John Fishwick Leeming (8 January 1895 – 3 July 1965) was an English entrepreneur, businessman, early aviator, co-founder of the Lancashire Aero Club, gardener and author.

Early life and family
John was born in Chorlton Lancashire in 1895, the youngest son of Henry and Edith Leeming. He had an older brother Henry (born 1886) and sister Jessie (born 1888). The 1901 census records the family living in 7 Demesne Road, Withington, together with Lucy Clifton (governess) and Florence Clark (servant, domestic). John's father Henry was an employer in a Silk & Cotton Manufacturing & Oil Merchant business together with his older brother John H Leeming. John was sent to a preparatory school in Southport, and sold his first published article at 13, and later became internationally known for his books, which sold in large numbers. Whilst at school he first saw the pioneering efforts of powered flying at Birkdale near Southport. In 1910 when John was 15 years he made his first glider and tried it on the sands there. The family moved to Hale in 1915 and in 1923 were living at Alderbank, 40 Ashley Road, Altrincham. In the spring of 1918 John (now 23 years) married Gladys Birch and they lived first at 38 Albert Road from 1920 to 1923 and later 23 Spring Road, Hale. They had two children David and John. The latter was involved in the Downside Abbey Air Crash of 15 May 1943.

Aviation interests
With the upsurge of aviation during the First World War, John built his next glider in 1921 in his parents' cellar, later moved to their garage at Bowdon Cheshire (now Greater Manchester), as it got bigger, then the greenhouse. In 1924 he flew his fifth glider which he had built from scrap from A.V.Roe & Co at their Woodford Airfield, with friends Tom Prince and Clement Wood and known as an LPW' after their initials. All his later gliders could be dismantled and stored in a garage. He crashed the glider and rebuilt it with a Douglas motorbike engine installed but it was too heavy to fly and they could only trundle around the field. The aircraft was based at Alexandra Park Aerodrome just outside Manchester City Centre from early 1924 until 1925 when the group moved to Woodford Aerodrome on invitation from the Avro Aircraft Company.

The Lancashire Aero Club
John and nine friends formed the Lancashire Aero Club in his greenhouse, the first aero club in Britain with John as first chairman and later president. In that same year 1924, the glider was completed and taken to Alexandra Park Aerodrome Manchester where it was tow-launched into the air behind a high-powered car, frequently being damaged and repaired during its exploits. When Alexandra Park Aerodrome closed in August 1924, the club was invited to move to Avro's Woodford airfield. The club is the largest and oldest surviving aero club in Britain. Manchester Corporation opened a new airport at Barton in 1930. In July the same year Miss Winifred Brown of the Lancashire Aero Club won the prestigious King's Cup Air Race in Hanworth, West of London, despite tough opposition from numerous famous pilots, flying the very latest aircraft, in front of a 30,000 crowd. World War II stopped club activities, and in September 1939, the club's aircraft were stored in Avro's hangars at Woodford. The club restarted at Barton in 1946.

Landing on a mountain
John had become famous for landing on the Chester Road near The Swan Inn in the 1920s to refuel at a petrol station and for a planned landing on the second highest mountain in England. In 1926 John Leeming, chairman of Lancashire aero club and Bert Hinkler (1892–1933), the Australian chief test pilot of A.V.Roe Avro Manchester, two daring airmen decided to lift the nation's spirits by being the first aircraft to land on a mountain in Great Britain. They chose to land on Helvellyn in the English Lake District, which is 3,117 feet above sea level. They set off in his Avro Avian 585 two-seater biplane on 22 December. They managed to land on the stony plateau which tops the fell, witnessed by a fell walker who was visiting the area. An academic, E.R. Dodds (1893–1979), Professor of Greek at the University of Birmingham, recorded the event, signing an old bill (receipt) to that effect, before they took off again. It was quite some feat. The plane had only a 30 yard run-up to the rim overlooking Red Tarn (a lake), as they flew back to Woodford, some 90 miles away south of Manchester. Today the event is marked by a slate which reads: "The first aeroplane to land on a mountain in Great Britain did so on this spot. On December 22nd 1926 John Leeming and Bert Hinkler in an AVRO 585 Gosport landed here and after a short stay flew back to Woodford".

Northern Air Lines (Manchester) Ltd
In 1928 he co-founded Northern Air Lines (Manchester) Ltd together with Mr. F. J. V. Holmes, acting as managers for the Manchester Corporation. They operated charter and pleasure flights from Manchester's early airfield at Barton, who based several Avro 504s and other types for training, club and charter flights. They had a two-seater De Havilland DH.60 Moths available for charter at one shilling per mile. Leeming was good at securing publicity for his airline, as Flight magazine reported frequently at the time:
"Northern Airlines, Ltd., have recently acquired a D.H.50A, to carry four passengers and pilot, for use in connection with their air taxi work from Barton Aerodrome, Manchester. This machine was christened The Lancastrian by Alderman Davy, chairman of the Manchester Aerodrome Special Committee, on November 13, and is their first "enclosed " machine. Northern Air Lines are carrying out a considerable amount of air taxi work, and their rates are about the cheapest of any in the country for passenger transport, working out at 6d. per mile per person."
" ... negotiations are in progress between Imperial Airways and the Northern Air Transport Company of Manchester, for ^the inauguration of a passenger air service between London and Manchester. It is proposed to connect up at Croydon with the Imperial Airways" ..."Mr. John Leeming, of Northern Air Lines, Ltd., has, together with Mr. M. Morgan, a motor engineer of the Ford Motor Co., invented this new flying instructor, which will be marketed at £25. It has proved a considerable ... "

Between 1926 and 1928, Leeming, using his good contacts with Sir Sefton Brancker (U.K. Director of Civil Aviation), the Royal Aero Club and the city leaders, orchestrated an eventually successful campaign for Manchester to construct the UK's first municipal aerodrome. Manchester Corporation opened Barton Aerodrome in 1928 but it proved to be unsuitable for large aircraft. John, had become an authority on flying, (his book Pilots 'A' Licence published in 1935), was asked to find a new airport location by Manchester Corporation. He recommended the Ringway site, which was initially rejected, but eventually they opened the aerodrome in 1938.

House and garden
In the early 1930s he built Owlpen, York Drive, Bowdon where he developed a two-acre garden, all up the left hand side of York Drive and Theobald Road. At the end of the plot near to the Lady of the Vale Convent he spent the whole of the 1930s developing the garden and built The Barn out of reclaimed handmade bricks and old oak beams and with a Priest's Hole. During this time he became an expert on delphiniums and wrote The Book of the Delphinium (1932) and The Garden Grows (1935) on the building of the garden. He bred pedigree sheep and had an interest in bee-keeping. In 1936 he created 'Claudius the Bee' for the Manchester Evening News for which Walt Disney bought the film rights. In that same year he wrote Airdays, based on his experiences as a pioneer of gliding and light-aeroplane flying in Great Britain. The house itself named ' Badgers', in Theobald Road Bowdon, was built after the war in 1948. He is said to have helped fund the neighbouring Bollingworth House given by Fanny Baxter to establish Our Lady of the Vale Convent on condition that he reserved the right to use an entrance from Theobald Road. His wife Gladys lived there for the last five years of her life.

RAF and World War II
John joined the Royal Air Force in 1939 and was commissioned a flight lieutenant and appointed to Air Marshal Owen Tudor Boyd as his aide-de-camp. John accompanied Boyd on his way to Egypt, in November 1940 as the new Deputy Commander of the British Air Forces in the Middle East. En route for Malta, the Wellington bomber in which Boyd and his staff were passengers was forced down over enemy-controlled Sicily by a group of Italian fighters. They destroyed confidential papers by setting the aircraft on fire, which included some £250,000 in currency, 11 million pounds in 2019. John was taken prisoner and to Villa Orsini close to the Sulmona PG 78, POW camp near Rome in the Abruzzo. 'He organised and ran the house, mess and batmen, and looked after us very well'. 'Leeming became one of my great friends in captivity. He had left his business at the beginning of the war to join the RAF., having been for years a skilled amateur pilot'. He later was transferred to Castello di Vincigliata camp near Florence, where he was to hatch his plan for escape. He took inspiration from a book published in 1920, The Road to En-Dor? in which tells the true story of how a couple of British officers' attained freedom from a Turkish prison camp in WW1 through an extremely elaborate pretence of mental illness.

Prisoner of war and escape
As Lieutenant General Sir Philip Neame wrote 'Leeming gave up running the mess in December 1941, after we had been in Florence for three months to devote himself to the plot'. 'His character interested me. I place him as an extremely shrewd man, very persistent and determined, but pleasant to deal with, with a most kindly nature and a flair for getting on with nearly anyone. But he delighted to appear to others as simple and easily overcome by circumstances, a pose which he developed so successfully that he managed to get himself repatriated as a very bad nervous breakdown case. I must say he worked hard for months on this astounding plot. He succeeded so well that the international Medical board, with Swiss and Italian doctors, unhesitatingly accepted his case for early repatriation' (in April 1943). 'However, he reached England and returned to duty. We used to spend many hours on the battlements of Castello di Vincigliata discussing [my] book, how to be an author and many other matters'. Leeming was influential in the escape plans, suggesting using the castle well system camouflaging and coding secret communications to MI9. He was repatriated from Lisbon on the British hospital ship HMHS Newfoundland (Furness Withy Line 6,791 tons). As he describes in his book, 'In the late afternoon, of 8 April 1943, we went aboard the British hospital ship, which was lying at the quay ready to sail for England. I walked quickly up the gangway, and as I felt my two feet touch the ship's deck I looked up – I suppose I am too sentimental – at the flag flying from the masthead. "Done it!" I said aloud.'... we docked at Avonmouth early in the morning of 23 April 1943. The sky was grey, and it was raining.'

Post war
After the war he wrote about his repatriation in April 1943 by feigning paranoia in The Natives are Friendly (1951). He also told of his experiences as a prisoner of the Italians during the Second World War in Always To-Morrow (1951). His war-time adventures in Italy inspired him to write some novels like It always rains in Rome (1960), A Girl like Wigan (1961), and Arnaldo my Brother (1962). Leeming described himself as 'a reluctant engineer', but retired as the managing director of a Broadheath firm, a suburb of Altrincham near Manchester, England which, amongst other feats, made money by extracting oil from rags and then selling the discarded material for further use. He died in 1965 aged 69.

Books by John F Leeming
Many of Leeming's books have been translated into French, Italian, German, Danish, Finnish and Dutch

 The Book of the Delphinium, 1932, 76 pages, Sir Isaac Pitman & Sons Ltd, London, several illustrations
 Pilots 'A' Licence, 1935, Sir Isaac Pitman & Sons Ltd, London
 The Garden Grows: a Story, 1935, George G Harrap & Co., London
 Manchester & Aviation, 1935 ?
 Airdays, 1936, George G Harrap &Co., 301 pages, some b/w photos, (author's experiences as a pioneer of gliding and light-aeroplane flying in Great Britain)
 Claudius the Bee, 1936, George G Harrap & Co., London, 128 pages, Illustrated by Richard B.Ogle. 128p  (also in French ('Jacky au pays des abeilles'), Dutch, German ('Claudius der Hummelkönig'))
 Thanks to Claudius, 1937, George G Harrap & Co Ltd,157 pages (also in French)
 The Natives are Friendly, 1951, E. P.Dutton & Company, New York, 1951, pages 195–222, (PoW, World War II experiences)
 Always To-Morrow, 1951, George G Harrap & Co. Ltd, London, 188pages, Illustrated with photographs and maps, (Tells of the author's experiences as a prisoner of the Italians during the Second World War)
 A Girl Like Scranton (a novel) 1961, Farrar, Straus and Cudahy, New York (title changed for US readers)
 A Girl like Wigan, (a novel) 1961, George G Harrap & Co (exotic adventure across Europe)
 It always rains in Rome, (a novel), 1960, Avon Books, (A hilarious account of what happens at the end of the war when the townspeople of Fontana d'Amore discover that their 14th-century bridge is about to be blown up by overzealous liberators on the one hand and a retreating enemy on the other) (also in German ('Die Brücke von Fontana d'Amore'), Italian, Dutch, Danish)
 Arnaldo my Brother, 1962, (a novel) 1962, Harrap, UK, (using his experiences at Villa Orsini and Castello di Vincigliata) (also in German 'Mein Bruder Arnaldo')

See also
LPW Glider
 Vincigliata
 Lancashire Aero Club
 HMHS Newfoundland
 Helvellyn

Bibliography and sources
 1901, UK Census Records for England,
 Altrincham Historical Society, Biographies of local people.
 Lancashire Aero Club, History, http://www.lancsaeroclub.co.uk
 Playing with Strife, (1947), The Autobiography of a Soldier, Lt-Gen. Sir Philip Neame, V.C., K.B.E., C.B., D.S.O., George G Harrap & Co. Ltd, 353 pages, (written whilst a POW, in Vincigliata - Campo PG12, contains a scale plan of Castello di Vincigliata, and photographs taken by the author, just after the war)
 Farewell Campo 12, (1945), Brigadier James Hargest, C.B.E., D.S.O. M.C., Michael Joseph Ltd, 184 pages contains a sketch map of Castello Vincigliata page 85, (no index)
 Happy Odyssey, (1950), Lt-Gen. Sir Carton De Wiart,V.C.,K.B.E.,C.M.G.,D.S.O., Jonathan Cape Ltd, in PAN paperback 1956, re-printed by Pen & Sword Books 2007, 287 pages,  (Foreword by Winston S Churchill)
 To War with Whitaker, (1994), Hermione Ranfurly, William Heinemann Ltd, London, 375 pages,
 Always To-Morrow, (1951), John F Leeming, George G Harrap & Co. Ltd, London, 188 pages, Illustrated with photographs and maps, (Tells of the authors' experiences as a prisoner of the Italians during the Second World War)
 The Natives are Friendly, (1951), E. P.Dutton & Company, New York, 1951, pages 195–222, (PoW, World War II experiences)
 Airdays, (1936), George G Harrap & Co., 301 pages, some b/w photos, (author's experiences as a pioneer of gliding and light-aeroplane flying in Great Britain)
 Manchester's early airfields: establishment, development and operations,(2004), R.A.Scholefield,an extensive article in "Moving Manchester", Lancashire & Cheshire Antiquarian Society, ISSN 0950-4699
 The Lancashire Aero Club: Three Score Years and Ten, (1992), Peter Maher, Lancashire Aero Club,
 http://www.flightglobal.com/pdfarchive/index.html The Flightglobal Archive, of 'Flight Magazine' published during the 1920s and 1930s, featured numerous articles on aviation and business news concerning John Leeming, his wife Sarah and associates, Lancashire Aero Club and his company, Northern Airlines (Manchester) Ltd.
 List of unreleased Disney animated shorts a. List of unreleased Disney animated shorts and feature films, Date: 1947, Series: Mickey Mouse, Title: Mickey and Claudius the Bee, Description: 'Mickey is shrunk down to the size of a bee and given a tour of the hive by Claudius'. This cartoon was explored as a possible release. But, for a variety of reasons, production was never completed, and this cartoon was never made.

References

Aviation pioneers
People from Chorlton-cum-Hardy
Royal Air Force officers
1895 births
1965 deaths


KMON-FM (94.5 MHz) is a radio station broadcasting a country music format. Licensed to Great Falls, Montana, United States, the station serves the Great Falls area. The station is currently owned by Townsquare Media and features programming from Premiere Networks and Westwood One.

History
The station went on the air as KNUW-FM on November 30, 1979. On November 2, 1984, the station changed its call sign to the current KMON.

KMON-HD2
On May 5, 2017, KMON-FM launched an adult alternative format on its HD2 subchannel, branded as "107.5 The Peak" (simulcast on translator K298BL 107.5 FM Great Falls).

References

External links

MON-FM
Radio stations established in 1979
1979 establishments in Montana
Townsquare Media radio stations


Hunter College Elementary School is a New York City elementary school for select students who reside in New York City, located on Manhattan's Upper East Side. Administered by Hunter College, a senior college of the City University of New York or CUNY.

History
Hunter College Elementary School was created in 1940 as an experimental school for gifted students.  It grew out of the Hunter College Model School and assumed its current name in 1941. From its inception until 1973, Hunter College Elementary School was located at the Hunter College campus at 68th Street and Lexington Avenue. Its current location is the Squadron A Armory at 71 East 94th Street in New York City.

Students from the elementary school generally continue from Kindergarten to 6th grade, and then (through affiliated Hunter College High School, located in the same building) through 12th grade.  The Wall Street Journal published a study in 2007 that showed Hunter to be among the top 20 feeder schools to top universities in the United States, and the only public school listed in the top 20.

Alumni
Notable alumni include:

Alex Alben, technology executive and author
Ron Brown, former U.S. Secretary of Commerce
Adam Cohen, scientist and professor at Harvard University
Bran Ferren, inventor
Roy M. Goodman, former New York State Senator
Elena Kagan, U.S. Supreme Court justice
Margaret Lefranc, former painter
Bobby Lopez, songwriter, EGOT winner
Fred Melamed, actor, comedian, and writer
Lin-Manuel Miranda, composer and actor best known for Hamilton
Cynthia Nixon, actress and political activist
Jonathan Tunick, orchestrator and musical director; EGOT winner
Hugh David Politzer, Nobel Prize winner in Physics (2004)

See also
 Hunter College
 Hunter College High School

Further reading
 Subotnik, Rena, et al. (1993) Genius Revisited: High IQ Children Grown Up. Ablex Publishing. .

References

External links
 Hunter College Elementary School

Magnet schools in New York (state)
Gifted education
Public elementary schools in Manhattan
Hunter College
Educational institutions established in 1940
1940 establishments in New York City


Andreas Raymond Dombret (born January 16, 1960, in the United States) is German-American banker who served as member of the executive board of the Deutsche Bundesbank from 2010 until 2018. In that capacity, he held responsibility for Banking and Financial Supervision, Risk Controlling and the Bundesbank's Representative Offices abroad.

Earlier in his career, Dombretwas the vice-chairman of Bank of America Global Investment Banking in Europe, the Middle East and Africa as well as head of the German, Austrian and Swiss branches. He holds dual German and American citizenship.

Early life and education
Dombret completed his MBA at Westfälische Wilhelms University Münster and earned his doctorate at Friedrich-Alexander University Erlangen-Nürnberg, where he wrote his dissertation on Takeover Premiums in M&A Transactions. Dombret is honorary professor at the European Business School in Oestrich-Winkel where he currently acts as visiting lecturer for the MBA graduate program in the courses Investment Banking and Capital Markets.

Career
From 2010 until 2018, Dombret was a member of the executive board of the Deutsche Bundesbank, responsible for Banking Supervision, Risk Control, Economic Education, University of Applied Sciences and Technical Central Bank Cooperation and the Bundesbank's representatives abroad. In this capacity, he was also a member of the Basel Committee on Banking Supervision, the supervisory board of the Single Supervisory Mechanism of the European Central Bank as well as the German Financial Stability Committee. From 2005 to 2009, Dombret served as vice chairman of Bank of America Global Investment Banking in Europe, the Middle East and Africa as well as head of the German, Austrian and Swiss branches. Prior to joining Bank of America, Dombret was a managing director and the co-head of Rothschild Germany. Prior to this, he spent 10 years with JP Morgan in London and in Frankfurt, and was a managing director in the Investment Banking Division covering German clients. Dombret began his career at the headquarters of Deutsche Bank.

After retiring from the board of the German central bank, Dombret continued to serve on the board of Basel-based Bank for International Settlements until the end of 2018 and subsequently assumed a portfolio of advisory mandates. Among them are consultancy firm Oliver Wyman, Sumitomo Mitsui Banking Corporation (SMBC) and London-headquartered Equity Research firm Autonomous. In addition, he advises US Investment House Houlihan Lokey as Independent Chairman DACH and German Fintech Deposit Solutions, speaks at conferences worldwide and teaches as Adjunct Senior Research Scholar at the Faculty of International & Public Affairs of Columbia University in New York City.

Other activities

Government agencies
 Center for Financial Studies, member of the board of trustees/advisory board

Non-profit organizations
 Economics Department at the University of Frankfurt, member of the board of trustees/advisory board
 University of Münster, member of the board of trustees
 Schirn Kunsthalle Frankfurt, member of the board of trustees
 Städel, member of the board of trustees/advisory board
 Austrian Society for Bank Research, member of the board of trustees
 Atlantik-Brücke, treasurer
 European School for Management and Technology (ESMT), member of the board of directors
 Hessische Kulturstiftung, Member of the Board of Trustees
 Salzburg Global Seminar, member of the board of directors
 International Centre for Monetary and Banking Studies (ICMB)/Geneva, member of the board
 Zeitschrift für das gesamte Kreditwesen, co-editor
 The International Economy, member of the advisory board of editors
 Central Banking , member of the advisory board

Awards
In 2007, Dombret was awarded the Cross of Merit of the Federal Republic of Germany (Bundesverdienstkreuz am Bande). In 2012, Dombret was honoured with the Austrian Cross of Honour for Science and Art. In 2013, he was awarded with the Hessian Order of Merit as well as with the Plaque of Honour of Frankfurt am Main. In 2016, Dombret was awarded the Weilburgpreis of the City of Baden, Austria, for his support of art and culture as well as the Japanese Order of the Rising Sun, Gold Rays with Neck Ribbon. In 2016, he was awarded the Order of the British Empire (OBE) for services to Anglo German economic and trade relations. In 2017, he obtained the silver cross of the Bundesland Niederösterreich (Lower Austria) for his support the Arnulf Rainer museum in Baden. In 2018, he was awarded the Chevalier de l'Ordre national du mérite of the French Republic.

Donations
Dombret sponsors the Andreas Dombret – Center for Students Initiatives (CSI) at the Westfälische Wilhelms University (WWU) in Münster and a graduation prize for one dissertation that best combines science and practice every year. For his merits for the university, Andreas Dombret was awarded with the WWU university medal in 2009. For his grant to the Arnulf Rainer museum in Baden (near Vienna) he was awarded with the "Grosse silberne Stadtwappen der Stadt Baden bei Wien" in January 2010.

Publications
 Dombret, A.R. (ed) (2017): "Bankenaufsicht im Dialog 2017", Schriftenreihe zum Bundesbank Symposium Vol. 3, Frankfurt am Main.
 Dombret, A..R.; Gündüz, Yalin; Rocholl, Jörg (2017): Will German Banks earn their cost of capital? In: Discussion Paper No 01/2017, Deutsche Bundesbank, Frankfurt.
 Dombret, A.R.(2017): European Financial Integration: Monetary Union, Banking Union, Capital Markets Union. In: Francioni, Reto / Schwartz, Robert A. (eds.): Equity Markets in Transition. Springer, Cham, S. 565-573
 Dombret, A.R. (ed) (2016): "Bankenaufsicht im Dialog 2016", Schriftenreihe zum Bundesbank Symposium Vol. 2, Frankfurt am Main.
 Dombret, A.R. (2016): Blase oder nicht – wo steht der deutsche Wohnimmobilienmarkt? In: ifo Schnelldienst 16/2016, 69. Jg., S. 20-25
 Dombret, A.R. (2016): Baustelle europäische Bankenunion – gemeinsame Aufsicht, gemeinsame Abwicklung, gemeinsame Einlagensicherung? In: Zeitschrift für das gesamte Kreditwesen, 69. Jg., Nr. 13, S. 632 ff.
 Dombret, A.R. (ed) (2015): "Bankenaufsicht im Dialog 2015", Schriftenreihe zum Bundesbank Symposium, Frankfurt am Main.
 Dombret, A.R. (2013): "Criteria for Financial Stability – The European View", in Dombret, A.R./Lucius, O.(Hg.): "Stability of the Financial System – Illusion or Feasible Concept?", Cheltenham, UK und Northampton, USA, 2013.
 Dombret, A.R. (2013): "Solving the Too-Big-To-Fail-Problem for Financial Institutions", in: Dombret, A.R./Kenadjian, P. (Hg.): "The Bank Recovery and Resolution Directive – Europe's Solution for 'Too Big To Fail'?", Berlin und Boston, 2013.

References

External links
 Manager Magazine, 29.05.2005
 University of Münster

1960 births
Living people
University of Münster alumni
University of Erlangen-Nuremberg alumni
American bankers
Bank of America executives
Central bankers
Recipients of the Cross of the Order of Merit of the Federal Republic of Germany
Recipients of the Austrian Cross of Honour for Science and Art


Camilla von Hollay (born Kamilla Borbála Hollay; 11 July 1899 – 9 February 1967) was a Hungarian film actress of the silent era. She appeared in more than 40 films between 1917 and 1930. She was born in Budapest, Austria-Hungary and died in Budapest.

Selected filmography

 A Régiséggyüjtö (1917)
 Casanova (1918)
 Az Élet királya (1917)
 The Fire Ship (1922)
 The Stolen Professor (1924)
 Passion (1925)
 Madame Wants No Children (1926)
 Superfluous People (1926)
 The Eleven Schill Officers (1926)
 A Sister of Six (1926)
 The Queen of the Baths (1926)
 At the Edge of the World (1927)
 The Weavers (1927)
 The Salvation Army Girl (1927)
 Break-in (1927)
 Potsdam (1927)
 The Duty to Remain Silent (1928)
 The Green Alley (1928)
  When the Mother and the Daughter (1928)
 Immorality (1928)
 The Saint and Her Fool (1928)
 The Abduction of the Sabine Women (1928)
 The Beaver Coat (1928)
 Waterloo (1929)
 The Great Longing (1930)
 Retreat on the Rhine (1930)
 Love and Champagne (1930)
 The Tender Relatives (1930)

External links

1899 births
1967 deaths
Hungarian film actresses
Hungarian silent film actresses
20th-century Hungarian actresses


KMON (560 AM) is a radio station broadcasting a classic country format. Licensed to Great Falls, Montana, United States, the station serves the Great Falls area. The station is currently owned by Townsquare Media and features programming from ABC News Radio and Compass Media Networks.

History
Prior to 1948, the then-unbuilt station had the call sign KMFR and was licensed to Sun River Broadcasting Company. After the station was licensed to Montana Farmer Broadcasting Corporation, that company requested a change in call sign to KMON. The request was approved by the Federal Communications Commission in February 1948.

References

External links

MON
Townsquare Media radio stations


The Metropolitan Archdiocese of Katowice () is the Latin Metropolitan archdiocese of the Catholic Church in Poland. It is an ecclesiastical province in Western Poland.

Special churches
Its cathedral archiepiscopal see is Archikatedra Chrystusa Króla, dedicated to Christ the King, in the city of Katowice, Śląskie.

It has several Minor basilicas :
 Bazylika św. Ludwika Króla i Wniebowzięcia Najświętszej Marii Panny, also in Katowice
 Bazylika Narodzenia Najświętszej Maryi Panny (Sanktuarium Matki Bożej Uśmiechniętej), in Pszów
 Bazylika NMP i św. Bartłomieja Apostoła (Sanktuarium Matki Sprawiedliwości i Miłości Społecznej), in Piekary Śląskie
 Bazylika św. Antoniego Padewskiego, in Rybnik.

Province
Its ecclesiastical province comprises the Metropolitan's own Archdiocese and these suffragan bishoprics:
 Roman Catholic Diocese of Gliwice
 Roman Catholic Diocese of Opole

History
On 7 November 1922, the Holy See disentangled the Roman Catholic parishes in the Polish Autonomous Silesian Voivodeship, territorially comprising the East of formerly Austrian Cieszyn Silesia (since 1918) and formerly German East Upper Silesia (since 1922) from the then Diocese of Breslau as a permanent Apostolic Administration of Upper Silesia on 17 December the same year.
 On 28 October 1925, Pope Pius XI elevated that apostolic administration and renamed it after its see to Diocese of Katowice, then as suffragan of the Metropolitan Archdiocese of Kraków, by the papal Bull Vixdum Poloniae Unitas.
 In 1947, it lost territory to establish the Apostolic Administration of Český Těšín.
 It enjoyed Papal visits from the Polish Pope John Paul II in June 1983 and June 1999.
 It was promoted on March 25, 1992 as Metropolitan Archdiocese of Katowice.

Statistics
As per 2014, it pastorally served 1,448,500 Catholics (97.4% of 1,487,500 total) on 2,400 km² in 319 parishes and 6 missions with 1,088 priests (963 diocesan, 125 religious), 1 deacon, 1,005 lay religious (189 brothers, 816 sisters) and 117 seminarians.

Episcopal ordinaries

Apostolic Administrator of Upper Silesia
 August Hlond, Salesians (S.D.B.) (1922.11.07 – 1925.10.28)

Suffragan Bishops of Katowice
 August Hlond (1925.12.14 – 1926.06.24), also President of Episcopal Conference of Poland (1926 – 1948.10.22), later Metropolitan Archbishop of Gniezno–Poznan (Poland) (1926.06.24 – 1948.10.22), created Cardinal-Priest of Santa Maria della Pace (1927.12.22 – 1948.10.22), Founder of the Society of Christ for Polish Immigrants (1932.09.08), Metropolitan Archbishop of Warszawa (Poland) (1946.06.13 – death 1948.10.22)
 Arkadiusz Lisiecki (1926.06.24 – death 1930.05.13)
 Stanisław Adamski (1930.09.02 – death 1967.11.12)
 Auxiliary Bishop: Teofilo Bromboszcz (1934.03.24 – death 1937.01.12), Titular Bishop of Candyba (1934.03.24 – 1937.01.12)
 Auxiliary Bishop: Juliusz Bieniek (1937.03.13 – death 1978.01.17), Titular Bishop of Dascylium (1937.03.13 – 1978.01.17)
 Auxiliary Bishop: Józef Kurpas (1962.11.23 – death 1992.05.19)Titular Bishop of Orisa (1962.11.23 – 1992.05.19)
 Herbert Bednorz (1967.11.12 – retired 1983), succeeding as former Coadjutor Bishop of Katowice (1950.05.04 – 1967.11.12) & Titular Bishop of Bulla regia (1950.05.04 – 1967.11.12)
 Auxiliary Bishop: Czesław Domin (1970.06.06 – 1992.02.01), Titular Bishop of Dagnum (1970.06.06 – 1992.02.01), later Bishop of Koszalin–Kołobrzeg (Poland) (1992.02.01 – death 1996.03.15)
 Auxiliary Bishop: Janusz Edmund Zimniak (1980.09.25 – 1992.03.25), Titular Bishop of Polignano (1980.09.25 – ...), next as Auxiliary Bishop of Bielsko–Żywiec (Poland) (1992.03.25 – retired 2010.01.16)
 Damian Zimoń (1985.06.03 – see promotion 1992.03.25 see below)
 Auxiliary Bishop: Gerard Bernacki (1988.03.18 – retired 2012.01.31), Titular Bishop of Sala Consilina (1988.03.18 – ...)

Metropolitan Archbishops of Katowice
 Damian Zimoń (see above 1992.03.25 – retired 2011.10.29)
 Auxiliary Bishop: Piotr Libera (1996.11.23 – 2007.05.02), Titular Bishop of Centuria (1996.11.23 – 2007.05.02), also Secretary General of Episcopal Conference of Poland (1998 – 2007); later Bishop of Płock (Poland) (2007.05.02 – ...)
 Auxiliary Bishop: Stefan Cichy (1998.08.26 – 2005.03.19), Titular Bishop of Bonusta (1998.08.26 – 2005.03.19), later Bishop of Legnica (Poland) (2005.03.19 – 2014.04.16)
 Auxiliary Bishop: Józef Piotr Kupny (2005.12.21 – 2013.05.18), Titular Bishop of Vanariona (2005.12.21 – 2013.05.18), later Metropolitan Archbishop of Wrocław (Breslau, Poland) (2013.05.18 – ...)
 Wiktor Skworc (2011.10.29 – 31 May 2023),
formerly Bishop of Tarnów (Poland) (1997.12.13 – 2011.10.29)
 Auxiliary Bishop: Marek Szkudło  (2014.12.13 – ...), Titular Bishop of Wigry (2014.12.13 – ...)
 Auxiliary Bishop: Adam Wodarczyk  (2014.12.13 – ...), Titular Bishop of Pomezania (2014.12.13 – ...).
 Adrian Joseph Galbas (31 May 2023 – present)

See also
 List of Catholic dioceses in Poland
 Roman Catholicism in Poland

Sources and external links
 GCatholic.org, with incumbent biography links - data for all sections
 Catholic Hierarchy
  Diocese website

References

Roman Catholic dioceses in Poland
Religious organizations established in 1925
Organisations based in Katowice
Roman Catholic dioceses and prelatures established in the 20th century


A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.

3D integrated circuits can be classified by their level of interconnect hierarchy at the global (package), intermediate (bond pad) and local (transistor) level.  In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs); 3D heterogeneous integration; and 3D systems integration.; as well as true monolithic 3D ICs

International organizations such as the Jisso Technology Roadmap Committee (JIC) and the International Technology Roadmap for Semiconductors (ITRS) have worked to classify the various 3D integration technologies to further the establishment of standards and roadmaps of 3D integration. As of the 2010s, 3D ICs are widely used for NAND flash memory and in mobile devices.

Types

3D ICs vs. 3D Packaging
3D packaging refers to 3D integration schemes that rely on traditional interconnection methods such as wire bonding and flip chip to achieve vertical stacking. 3D packaging can be divided into 3D system in package (3D SiP) and 3D wafer level package (3D WLP). 3D SiPs that have been in mainstream manufacturing for some time and have a well-established infrastructure include stacked memory dies interconnected with wire bonds and package on package (PoP) configurations interconnected with wire bonds or flip chip technology. PoP is used for vertically integrating disparate technologies. 3D WLP uses wafer level processes such as redistribution layers (RDLs) and wafer bumping processes to form interconnects.

2.5D interposer is a 3D WLP that interconnects dies side-by-side on a silicon, glass, or organic interposer using through silicon vias (TSVs) and an RDL. In all types of 3D packaging, chips in the package communicate using off-chip signaling, much as if they were mounted in separate packages on a normal printed circuit board. The interposer may be made of silicon, and is under the dies it connects together. A design can be split into several dies, and then mounted on the interposer with micro bumps.

3D ICs can be divided into 3D Stacked ICs (3D SIC), which refers to advanced packaging techniques stacking IC chips using TSV interconnects, and monolithic 3D ICs, which use fab processes to realize 3D interconnects at the local levels of the on-chip wiring hierarchy as set forth by the ITRS, this results in direct vertical interconnects between device layers. The first examples of a monolithic approach are seen in Samsung's 3D V-NAND devices.

As of the 2010s, 3D IC packages are widely used for NAND flash memory in mobile devices.

3D SiCs
The digital electronics market requires a higher density semiconductor memory chip to cater to recently released CPU components, and the multiple die stacking technique has been suggested as a solution to this problem. JEDEC disclosed the upcoming DRAM technology includes the "3D SiC" die stacking plan at "Server Memory Forum", November 1–2, 2011, Santa Clara, CA. In August 2014, Samsung Electronics started producing 64GB SDRAM modules for servers based on emerging DDR4 (double-data rate 4) memory using 3D TSV package technology. Newer proposed standards for 3D stacked DRAM include Wide I/O, Wide I/O 2, Hybrid Memory Cube, High Bandwidth Memory.

Monolithic 3D ICs
True monolithic 3D ICs are built in layers on a single semiconductor wafer, which is then diced into 3D ICs. There is only one substrate, hence no need for aligning, thinning, bonding, or through-silicon vias.  In general, monolithic 3D ICs are still a developing technology and are considered by most to be several years away from production.

Process temperature limitations can be addressed by partitioning the transistor fabrication into two phases. A high temperature phase which is done before layer transfer followed by a layer transfer using ion-cut, also known as layer transfer, which has been used to produce Silicon on Insulator (SOI) wafers for the past two decades. Multiple thin (10s–100s nanometer scale) layers of virtually defect-free Silicon can be created by utilizing low temperature (<400 °C) bond and cleave techniques, and placed on top of active transistor circuitry. Follow by finalizing the transistors using etch and deposition processes. This monolithic 3D IC technology has been researched at Stanford University under a DARPA-sponsored grant.
m
CEA-Leti also developed monolithic 3D IC approaches, called sequential 3D IC. In 2014, the French research institute introduced its CoolCube™, a low-temperature process flow that provides a true path to 3DVLSI.

At Stanford University, researchers designed monolithic 3D ICs using carbon nanotube (CNT) structures vs. silicon using a wafer-scale low temperature CNT transfer processes that can be done at 120 °C.

Manufacturing Technologies for 3D SiCs
There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) and through-silicon via (TSV). As of 2014, a number of memory products such as High Bandwidth Memory (HBM) and the Hybrid Memory Cube have been launched that implement 3D IC stacking with TSVs. There are a number of key stacking approaches being implemented and explored. These include die-to-die, die-to-wafer, and wafer-to-wafer.

 Die-to-Die Electronic components are built on multiple die, which are then aligned and bonded. Thinning and TSV creation may be done before or after bonding. One advantage of die-to-die is that each component die can be tested first, so that one bad die does not ruin an entire stack. Moreover, each die in the 3D IC can be binned beforehand, so that they can be mixed and matched to optimize power consumption and performance (e.g. matching multiple dice from the low power process corner for a mobile application).
 Die-to-Wafer Electronic components are built on two semiconductor wafers. One wafer is diced; the singulated dice are aligned and bonded onto die sites of the second wafer. As in the wafer-on-wafer method, thinning and TSV creation are performed either before or after bonding. Additional die may be added to the stacks before dicing.
 Wafer-to-Wafer Electronic components are built on two or more semiconductor wafers, which are then aligned, bonded, and diced into 3D ICs. Each wafer may be thinned before or after bonding. Vertical connections are either built into the wafers before bonding or else created in the stack after bonding. These "through-silicon vias" (TSVs) pass through the silicon substrate(s) between active layers and/or between an active layer and an external bond pad. Wafer-to-wafer bonding can reduce yields, since if any 1 of N chips in a 3D IC are defective, the entire 3D IC will be defective. Moreover, the wafers must be the same size, but many exotic materials (e.g. III-Vs) are manufactured on much smaller wafers than CMOS logic or DRAM (typically 300 mm), complicating heterogeneous integration.

Benefits
While traditional CMOS scaling processes improves signal propagation speed, scaling from current manufacturing and chip-design technologies is becoming more difficult and costly, in part because of power-density constraints, and in part because interconnects do not become faster while transistors do. 3D ICs address the scaling challenge by stacking 2D dies and connecting them in the 3rd dimension. This promises to speed up communication between layered chips, compared to planar layout. 3D ICs promise many significant benefits, including:

 Footprint More functionality fits into a small space. This extends Moore's law and enables a new generation of tiny but powerful devices.
 Cost Partitioning a large chip into multiple smaller dies with 3D stacking can improve the yield and reduce the fabrication cost if individual dies are tested separately.
 Heterogeneous Integration Circuit layers can be built with different processes, or even on different types of wafers. This means that components can be optimized to a much greater degree than if they were built together on a single wafer. Moreover, components with incompatible manufacturing could be combined in a single 3D IC.
 Shorter Interconnect The average wire length is reduced. Common figures reported by researchers are on the order of 10–15%, but this reduction mostly applies to longer interconnect, which may affect circuit delay by a greater amount. Given that 3D wires have much higher capacitance than conventional in-die wires, circuit delay may or may not improve.
 Power Keeping a signal on-chip can reduce its power consumption by 10–100 times. Shorter wires also reduce power consumption by producing less parasitic capacitance. Reducing the power budget leads to less heat generation, extended battery life, and lower cost of operation.
 Design The vertical dimension adds a higher order of connectivity and offers new design possibilities.
 Circuit Security 3D integration can achieve security through obscurity; the stacked structure complicates attempts to reverse engineer the circuitry. Sensitive circuits may also be divided among the layers in such a way as to obscure the function of each layer. Moreover, 3D integration allows to integrate dedicated, system monitor-like features in separate layers. The objective here is to implement some kind of hardware firewall for any commodity components/chips to be monitored at runtime, seeking to protect the whole electronic system against run-time attacks as well as malicious hardware modifications.
 Bandwidth 3D integration allows large numbers of vertical vias between the layers. This allows construction of wide bandwidth buses between functional blocks in different layers. A typical example would be a processor+memory 3D stack, with the cache memory stacked on top of the processor. This arrangement allows a bus much wider than the typical 128 or 256 bits between the cache and processor. Wide buses in turn alleviate the memory wall problem.

Challenges
Because this technology is new, it carries new challenges, including:
 Cost While cost is a benefit when compared with scaling, it has also been identified as a challenge to the commercialization of 3D ICs in mainstream consumer applications. However, work is being done to address this. Although 3D technology is new and fairly complex, the cost of the manufacturing process is surprisingly straightforward when broken down into the activities that build up the entire process. By analyzing the combination of activities that lay at the base, cost drivers can be identified. Once the cost drivers are identified, it becomes a less complicated endeavor to determine where the majority of cost comes from and, more importantly, where cost has the potential to be reduced.
 Yield Each extra manufacturing step adds a risk for defects. In order for 3D ICs to be commercially viable, defects could be repaired or tolerated, or defect density can be improved.
 Heat Heat building up within the stack must be dissipated. This is an inevitable issue as electrical proximity correlates with thermal proximity. Specific thermal hotspots must be more carefully managed.
 Design Complexity Taking full advantage of 3D integration requires sophisticated design techniques and new CAD tools.
 TSV-introduced Overhead TSVs are large compared to gates and impact floorplans. At the 45 nm technology node, the area footprint of a 10μm x 10μm TSV is comparable to that of about 50 gates. Furthermore, manufacturability demands landing pads and keep-out zones which further increase TSV area footprint. Depending on the technology choices, TSVs block some subset of layout resources. Via-first TSVs are manufactured before metallization, thus occupy the device layer and result in placement obstacles. Via-last TSVs are manufactured after metallization and pass through the chip. Thus, they occupy both the device and metal layers, resulting in placement and routing obstacles. While the usage of TSVs is generally expected to reduce wirelength, this depends on the number of TSVs and their characteristics. Also, the granularity of inter-die partitioning impacts wirelength. It typically decreases for moderate (blocks with 20-100 modules) and coarse (block-level partitioning) granularities, but increases for fine (gate-level partitioning) granularities.
 Testing To achieve high overall yield and reduce costs, separate testing of independent dies is essential. However, tight integration between adjacent active layers in 3D ICs entails a significant amount of interconnect between different sections of the same circuit module that were partitioned to different dies. Aside from the massive overhead introduced by required TSVs, sections of such a module, e.g., a multiplier, cannot be independently tested by conventional techniques. This particularly applies to timing-critical paths laid out in 3D.
 Lack of Standards There are few standards for TSV-based 3D IC design, manufacturing, and packaging, although this issue is being addressed. In addition, there are many integration options being explored such as via-last, via-first, via-middle; interposers or direct bonding; etc.
 Heterogeneous Integration Supply Chain In heterogeneously integrated systems, the delay of one part from one of the different parts suppliers delays the delivery of the whole product, and so delays the revenue for each of the 3D IC part suppliers.
 Lack of Clearly Defined Ownership It is unclear who should own the 3D IC integration and packaging/assembly. It could be assembly houses like ASE or the product OEMs.

Design Styles
Depending on partitioning granularity, different design styles can be distinguished. Gate-level integration faces multiple challenges and currently appears less practical than block-level integration.

 Gate-level Integration This style partitions standard cells between multiple dies. It promises wirelength reduction and great flexibility. However, wirelength reduction may be undermined unless modules of certain minimal size are preserved. On the other hand, its adverse effects include the massive number of necessary TSVs for interconnects. This design style requires 3D place-and-route tools, which are unavailable yet. Also, partitioning a design block across multiple dies implies that it cannot be fully tested before die stacking. After die stacking (post-bond testing), a single failed die can render several good dies unusable, undermining yield. This style also amplifies the impact of process variation, especially inter-die variation. In fact, a 3D layout may yield more poorly than the same circuit laid out in 2D, contrary to the original promise of 3D IC integration. Furthermore, this design style requires to redesign available Intellectual Property, since existing IP blocks and EDA tools do not provision for 3D integration.
 Block-level Integration This style assigns entire design blocks to separate dies. Design blocks subsume most of the netlist connectivity and are linked by a small number of global interconnects. Therefore, block-level integration promises to reduce TSV overhead. Sophisticated 3D systems combining heterogeneous dies require distinct manufacturing processes at different technology nodes for fast and low-power random logic, several memory types, analog and RF circuits, etc. Block-level integration, which allows separate and optimized manufacturing processes, thus appears crucial for 3D integration. Furthermore, this style might facilitate the transition from current 2D design towards 3D IC design. Basically, 3D-aware tools are only needed for partitioning and thermal analysis. Separate dies will be designed using (adapted) 2D tools and 2D blocks. This is motivated by the broad availability of reliable IP blocks. It is more convenient to use available 2D IP blocks and to place the mandatory TSVs in the unoccupied space between blocks instead of redesigning IP blocks and embedding TSVs. Design-for-testability structures are a key component of IP blocks and can therefore be used to facilitate testing for 3D ICs. Also, critical paths can be mostly embedded within 2D blocks, which limits the impact of TSV and inter-die variation on manufacturing yield. Finally, modern chip design often requires last-minute engineering changes. Restricting the impact of such changes to single dies is essential to limit cost.

History
Several years after the MOS integrated circuit (MOS IC) chip was first proposed by Mohamed Atalla at Bell Labs in 1960, the concept of a three-dimensional MOS integrated circuit was proposed by Texas Instruments researchers Robert W. Haisty, Rowland E. Johnson and Edward W. Mehal in 1964. In 1969, the concept of a three-dimensional MOS integrated circuit memory chip was proposed by NEC researchers Katsuhiro Onoda, Ryo Igarashi, Toshio Wada, Sho Nakanuma and Toru Tsujide.

Arm has made a high-density 3D logic test chip, and Intel with its Foveros 3D logic chip packing is planning to ship CPUs using it.

Demonstrations (19832012)

Japan (19832005)
3D ICs were first successfully demonstrated in 1980s Japan, where research and development (R&D) on 3D ICs was initiated in 1981 with the "Three Dimensional Circuit Element R&D Project" by the Research and Development Association for Future (New) Electron Devices. There were initially two forms of 3D IC design being investigated, recrystallization and wafer bonding, with the earliest successful demonstrations using recrystallization. In October 1983, a Fujitsu research team including S. Kawamura, Nobuo Sasaki and T. Iwai successfully fabricated a three-dimensional complementary metal–oxide–semiconductor (CMOS) integrated circuit, using laser beam recrystallization. It consisted of a structure in which one type of transistor is fabricated directly above a transistor of the opposite type, with separate gates and an insulator in between. A double-layer of silicon nitride and phosphosilicate glass (PSG) film was used as an intermediate insulating layer between the top and bottom devices. This provided the basis for realizing a multi-layered 3D device composed of vertically stacked transistors, with separate gates and an insulating layer in between. In December 1983, the same Fujitsu research team fabricated a 3D integrated circuit with a silicon-on-insulator (SOI) CMOS structure. The following year, they fabricated a 3D gate array with vertically stacked dual SOI/CMOS structure using beam recrystallization.

In 1986, Mitsubishi Electric researchers Yoichi Akasaka and Tadashi Nishimura laid out the basic concepts and proposed technologies for 3D ICs. The following year, a Mitsubishi research team including Nishimura, Akasaka and Osaka University graduate Yasuo Inoue fabricated an image signal processor (ISP) on a 3D IC, with an array of photosensors, CMOS A-to-D converters, arithmetic logic units (ALU) and shift registers arranged in a three-layer structure. In 1989, an NEC research team led by Yoshihiro Hayashi fabricated a 3D IC with a four-layer structure using laser beam crystallisation. In 1990, a Matsushita research team including K. Yamazaki, Y. Itoh and A. Wada fabricated a parallel image signal processor on a four-layer 3D IC, with SOI (silicon-on-insulator) layers formed by laser recrystallization, and the four layers consisting of an optical sensor, level detector, memory and ALU.

The most common form of 3D IC design is wafer bonding. Wafer bonding was initially called "cumulatively bonded IC" (CUBIC), which began development in 1981 with the "Three Dimensional Circuit Element R&D Project" in Japan and was completed in 1990 by Yoshihiro Hayashi's NEC research team, who demonstrated a method where several thin-film devices are bonded cumulatively, which would allow a large number of device layers. They proposed fabrication of separate devices in separate wafers, reduction in the thickness of the wafers, providing front and back leads, and connecting the thinned die to each other. They used CUBIC technology to fabricate and test a two active layer device in a top-to-bottom fashion, having a bulk-Si NMOS FET lower layer and a thinned NMOS FET upper layer, and proposed CUBIC technology that could fabricate 3D ICs with more than three active layers.

The first 3D IC stacked chips fabricated with a through-silicon via (TSV) process were invented in 1980s Japan. Hitachi filed a Japanese patent in 1983, followed by Fujitsu in 1984. In 1986, a Japanese patent filed by Fujitsu described a stacked chip structure using TSV. In 1989, Mitsumasa Koyonagi of Tohoku University pioneered the technique of wafer-to-wafer bonding with TSV, which he used to fabricate a 3D LSI chip in 1989. In 1999, the Association of Super-Advanced Electronics Technologies (ASET) in Japan began funding the development of 3D IC chips using TSV technology, called the "R&D on High Density Electronic System Integration Technology" project. The term "through-silicon via" (TSV) was coined by Tru-Si Technologies researchers Sergey Savastiouk, O. Siniaguine, and E. Korczynski, who proposed a TSV method for a 3D wafer-level packaging (WLP) solution in 2000.

The Koyanagi Group at Tohoku University, led by Mitsumasa Koyanagi, used TSV technology to fabricate a three-layer memory chip in 2000, a three-layer artificial retina chip in 2001, a three-layer microprocessor in 2002, and a ten-layer memory chip in 2005. The same year, a Stanford University research team consisting of Kaustav Banerjee, Shukri J. Souri, Pawan Kapur and Krishna C. Saraswat presented a novel 3D chip design that exploits the vertical dimension to alleviate the interconnect related problems and facilitates heterogeneous integration of technologies to realize a system-on-a-chip (SoC) design.

In 2001, a Toshiba research team including T. Imoto, M. Matsui and C. Takubo developed a "System Block Module" wafer bonding process for manufacturing 3D IC packages.

Europe (19882005)
Fraunhofer and Siemens began research on 3D IC integration in 1987. In 1988, they fabricated 3D CMOS IC devices based on re-crystallization of poly-silicon. In 1997, the inter-chip via (ICV) method was developed by a FraunhoferSiemens research team including Peter Ramm, Manfred Engelhardt, Werner Pamler, Christof Landesberger and Armin Klumpp. It was a first industrial 3D IC process, based on Siemens CMOS fab wafers. A variation of that TSV process was later called TSV-SLID (solid liquid inter-diffusion) technology. It was an approach to 3D IC design based on low temperature wafer bonding and vertical integration of IC devices using inter-chip vias, which they patented.

Ramm went on to develop industry-academic consortia for production of relevant 3D integration technologies. In the German funded cooperative VIC project between Siemens and Fraunhofer, they demonstrated a complete industrial 3D IC stacking process (1993–1996). With his Siemens and Fraunhofer colleagues, Ramm published results showing the details of key processes such as 3D metallization [T. Grassl, P. Ramm, M. Engelhardt, Z. Gabric, O. Spindler, First International Dielectrics for VLSI/ULSI Interconnection Metallization Conference – DUMIC, Santa Clara, CA, 20–22 Feb, 1995] and at ECTC 1995 they presented early investigations on stacked memory in processors.

In the early 2000s, a team of Fraunhofer and Infineon Munich researchers investigated 3D TSV technologies with particular focus on die-to-substrate stacking within the German/Austrian EUREKA project VSI and initiated the European Integrating Projects e-CUBES, as a first European 3D technology platform, and e-BRAINS with a.o., Infineon, Siemens, EPFL, IMEC and Tyndall, where heterogeneous 3D integrated system demonstrators were fabricated and evaluated. A particular focus of the e-BRAINS project was the development of novel low-temperature processes for highly reliable 3D integrated sensor systems.

United States (19992012)
Copper-to-copper wafer bonding, also called Cu-Cu connections or Cu-Cu wafer bonding, was developed at MIT by a research team consisting of Andy Fan, Adnan-ur Rahman and Rafael Reif in 1999. Reif and Fan further investigated Cu-Cu wafer bonding with other MIT researchers including Kuan-Neng Chen, Shamik Das, Chuan Seng Tan and Nisha Checka during 20012002. In 2003, DARPA and the Microelectronics Center of North Carolina (MCNC) began funding R&D on 3D IC technology.

In 2004, Tezzaron Semiconductor built working 3D devices from six different designs.  The chips were built in two layers with "via-first" tungsten TSVs for vertical interconnection.  Two wafers were stacked face-to-face and bonded with a copper process.  The top wafer was thinned and the two-wafer stack was then diced into chips.  The first chip tested was a simple memory register, but the most notable of the set was an 8051 processor/memory stack that exhibited much higher speed and lower power consumption than an analogous 2D assembly.

In 2004, Intel presented a 3D version of the Pentium 4 CPU. The chip was manufactured with two dies using face-to-face stacking, which allowed a dense via structure. Backside TSVs are used for I/O and power supply. For the 3D floorplan, designers manually arranged functional blocks in each die aiming for power reduction and performance improvement. Splitting large and high-power blocks and careful rearrangement allowed to limit thermal hotspots. The 3D design provides 15% performance improvement (due to eliminated pipeline stages) and 15% power saving (due to eliminated repeaters and reduced wiring) compared to the 2D Pentium 4.

The Teraflops Research Chip introduced in 2007 by Intel is an experimental 80-core design with stacked memory. Due to the high demand for memory bandwidth, a traditional I/O approach would consume 10 to 25 W. To improve upon that, Intel designers implemented a TSV-based memory bus. Each core is connected to one memory tile in the SRAM die with a link that provides 12 GB/s bandwidth, resulting in a total bandwidth of 1 TB/s while consuming only 2.2 W.

An academic implementation of a 3D processor was presented in 2008 at the University of Rochester by Professor Eby Friedman and his students. The chip runs at a 1.4 GHz and it was designed for optimized vertical processing between the stacked chips which gives the 3D processor abilities that the traditional one layered chip could not reach. One challenge in manufacturing of the three-dimensional chip was to make all of the layers work in harmony without any obstacles that would interfere with a piece of information traveling from one layer to another.

In ISSCC 2012, two 3D-IC-based multi-core designs using GlobalFoundries' 130 nm process and Tezzaron's FaStack technology were presented and demonstrated:

 3D-MAPS, a 64 custom core implementation with two-logic-die stack, was demonstrated by researchers from the School of Electrical and Computer Engineering at Georgia Institute of Technology.
 Centip3De, near-threshold design based on ARM Cortex-M3 cores, was from the Department of Electrical Engineering and Computer Science at University of Michigan.

Commercial 3D ICs (2004present)

The earliest known commercial use of a 3D IC chip was in Sony's PlayStation Portable (PSP) handheld game console, released in 2004. The PSP hardware includes eDRAM (embedded DRAM) memory manufactured by Toshiba in a 3D system-in-package chip with two dies stacked vertically. Toshiba called it "semi-embedded DRAM" at the time, before later calling it a stacked "chip-on-chip" (CoC) solution.

In April 2007, Toshiba commercialized an eight-layer 3D IC, the 16GB THGAM embedded NAND flash memory chip, which was manufactured with eight stacked 2GB NAND flash chips. In September 2007, Hynix introduced 24-layer 3D IC technology, with a 16GB flash memory chip that was manufactured with 24 stacked NAND flash chips using a wafer bonding process. Toshiba also used an eight-layer 3D IC for their 32GB THGBM flash chip in 2008. In 2010, Toshiba used a 16-layer 3D IC for their 128GB THGBM2 flash chip, which was manufactured with 16 stacked 8GB chips. In the 2010s, 3D ICs came into widespread commercial use in the form of multi-chip package and package on package solutions for NAND flash memory in mobile devices.

Elpida Memory developed the first 8GB DRAM chip (stacked with four DDR3 SDRAM dies) in September 2009, and released it in June 2011. TSMC announced plans for 3D IC production with TSV technology in January 2010. In 2011, SK Hynix introduced 16GB DDR3 SDRAM (40nm class) using TSV technology, Samsung Electronics introduced 3D-stacked 32GB DDR3 (30nm class) based on TSV in September, and then Samsung and Micron Technology announced TSV-based Hybrid Memory Cube (HMC) technology in October.

High Bandwidth Memory (HBM), developed by Samsung, AMD, and SK Hynix, uses stacked chips and TSVs. The first HBM memory chip was manufactured by SK Hynix in 2013. In January 2016, Samsung Electronics announced early mass production of HBM2, at up to 8 GB per stack.

In 2017, Samsung Electronics combined 3D IC stacking with its 3D V-NAND technology (based on charge trap flash technology), manufacturing its 512GB KLUFG8R1EM flash memory chip with eight stacked 64-layer V-NAND chips. In 2019, Samsung produced a 1TB flash chip with 16 stacked V-NAND dies. As of 2018, Intel is considering the use of 3D ICs to improve performance. , 232-layer NAND, i.e. memory device, chips are made by Micron, that previously in April 2019 were making 96-layer chips; and Toshiba made 96-layer devices in 2018.

In 2022, AMD has introduced Zen 4 processors, and some Zen 4 processors have 3D Cache included.

See also
 Charge trap flash (CTF)
 FinFET (3D transistor)
 MOSFET
 Multigate device (MuGFET)
 V-NAND (3D NAND)

Notes

References

 JEDECが「DDR4」とTSVを使う「3DS」メモリ技術の概要を明らかに - 後藤弘茂のWeekly海外ニュース Impress Watch Co. (issued:2011-11-08, 2011-11-08)
 貫通電極を用いたチップ積層技術の開発 (Japanese) oki technical review #211 Vol.74 #3 (issued:2007-10, 2011-11-08)
 TSV (Through Silicon Via:Si貫通電極) (Japanese) Akita Elpida Memory, inc (2011-11-08)

Further reading
 Philip Garrou, Christopher Bower, Peter Ramm: Handbook of 3D Integration, Technology and Applications of 3D Integrated Circuits Vol. 1 and Vol. 2, Wiley-VCH, Weinheim 2008, .
 Yuan Xie, Jason Cong, Sachin Sapatnekar: Three-Dimensional Integrated Circuit Design: Eda, Design And Microarchitectures, Publisher: Springer, , , 978–1441907837, Publishing Date: Dec. 2009.
 Philip Garrou, Mitsumasa Koyanagi, Peter Ramm: Handbook of 3D Integration, 3D Process Technology Vol. 3, Wiley-VCH, Weinheim 2014, .
 Paul D. Franzon, Erik Jan Marinissen, Muhannad S. Bakir, Philip Garrou, Mitsumasa Koyanagi, Peter Ramm: Handbook of 3D Integration: "Design, Test, and Thermal Management of 3D Integrated Circuits", Vol. 4, Wiley-VCH, Weinheim 2019, .

External links

Integrated circuits
Semiconductor device fabrication
Packaging (microfabrication)
Emerging technologies
Japanese inventions
MOSFETs


The A4118 road is in Swansea, Wales, connecting Dyfatty Street in Swansea City Centre with Port Eynon in the Gower Peninsula. The route runs through suburban areas until it reaches Upper Killay, where the road enters rural Gower. It passes over Fairwood Common and through several villages before terminating at Port Eynon.

Route
The A4118 starts at Dyfatty Street in Swansea city centre at the junction with the A483 Carmarthen Road, which is just north of Swansea railway station. It then goes westwards through the town centre. It passes through Mount Pleasant and Uplands before reaching Sketty, where having passed the parish church of St Pauls and Holy Trinity, it crosses the A4216.

After passing through Killay and Upper Killay, where the B4271 branches off to the right, the A4118 turns towards the southwest and leaves the main urban area of Swansea and the scenery becomes more rural. The road crosses Fairwood Common, where Swansea Airport can be seen on the right, and after turning westward the road becomes more scenic with Pennard Castle and the links course of Pennard Golf Club visible to the left. It then passes through the villages of Parkmill, Penmaen and Knelston. Here the road swings round to the south and passes through the village of Llandewi. The B4247 to Rhossilli branches off to the right and the A4118 descends to the coast.

References

Roads in Wales
4118


Fella may refer to:

People
 Fella El Djazairia, stage name of Algerian singer, pianist and performer Fella Ababsa (born 1961)
 Fella Makafui (born 1995), Ghanaian actress
 Edward Fella (born 1938), American graphic designer, artist and educator
 Giuseppe Fella (born 1993), Italian footballer

Other uses
 Fella-Werke, a German agricultural machine manufacturer
 Fellach, also called Fella, a river of Bavaria, Germany
 Fella (river), a river near Tarvisio, Friuli Venezia Giulia, Italy
 "Fella", the official deviantArt mascot
 Fella, a 2018 album by Danheim

See also
 Feller (disambiguation)
 Fellow (disambiguation)
 NAFO (group)


William Barton Worthington (8 July 1854 – 29 December 1939) was a British civil engineer.

William Worthington was born in Lancaster to Samuel Barton Worthington, a railway engineer. He was educated at Owens College, Manchester, and then at the University of London. Following this he was apprenticed to his father. Upon completion of his apprenticeship he joined Blyth & Cunningham of Edinburgh working on projects for the Caledonian Railway.

In 1876 he became the resident engineer for the London and North Western Railway, working on the construction of Manchester Exchange Station. During this time he worked under the supervision of the Chief Engineer, William Baker. In 1890 he was appointed assistant engineer to the Lancashire and Yorkshire Railway, becoming their chief engineer in 1897. He became chief engineer at Midland Railway in 1905, remaining there until his retirement in 1915.

He then set up practice as a consultant engineer and served as president of the Institution of Civil Engineers between 1921 and 1922.

References

British civil engineers
1854 births
1939 deaths
Presidents of the Institution of Civil Engineers
Presidents of the Smeatonian Society of Civil Engineers
Alumni of the University of London
People from Lancaster, Lancashire


KMON may refer to:

 KMON (AM), a radio station (560 AM) licensed to Great Falls, Montana, United States
 KMON-FM, a radio station (94.5 FM) licensed to Great Falls, Montana, United States


Gary Wynn Yohe is the  Huffington Foundation Professor of Economics and Environmental Studies at Wesleyan University, Middletown, Connecticut. He holds a PhD from Yale University.

Yohe specializes in Microeconomic theory, Natural Resources, and Environmental Economics. He is a researcher on the economics of climate change and integrated assessment modelling. Among other works, he is an editor of the book "Avoiding Dangerous Climate Change" and co-author (with Edwin Mansfield) of "Microeconomics| Microeconomics: Theory and Applications". He is a senior member of the United Nations Intergovernmental Panel on Climate Change (IPCC) that was awarded a share of the 2007 Nobel Peace Prize with Al Gore. He has been involved with the IPCC since the mid-1990s, has served, among other capacities, as a Lead Author for four different chapters in the IPCC Third Assessment Report, and as Convening Lead Author for the last chapter of the contribution of Working Group II to the IPCC Fourth Assessment Report. Yohe also worked with the Core Writing Team to prepare the overall Synthesis Report for the entire Assessment.

Yohe is also a member of the New York City Panel on Climate Change and the standing Committee on the Human Dimensions of Global Change of the National Academy of Sciences. He is also a standing member of the National Academy of Sciences' Committee on the Human Dimensions of Global Change.  He was a vice-chair of the Third National Climate Assessment.

He is one of the four co-signers of an open letter, dated March 12, 2010, regarding possible errors in the IPCC Fourth Assessment Report and regularly advises the US government.

References

External links

 Google Scholar

Energy economists
Environmental economists
Sustainability advocates
American economists
Intergovernmental Panel on Climate Change lead authors
Wesleyan University faculty
Yale University alumni
Living people
Year of birth missing (living people)
Ecology journal editors


Carl Fletcher may refer to:
 Carl Fletcher (Welsh footballer) (born 1980), Welsh former footballer and manager
 Carl Fletcher (Canadian soccer) (born 1971), former professional Canadian soccer defender

See also
 Karl Fletcher, fictional character in TV series Dream Team


KEIN (1310 AM) is a comedy formatted radio station licensed to Great Falls, Montana, United States and serving the Great Falls area. The station is currently owned by Wayne Ferree & Creed Evans, through licensee Tiger Butte Broadcasting, Inc., and features programming from Today's Comedy. It was first licensed as KFBB in July 1922, and is Montana's oldest radio station.

History
KEIN was first licensed on July 11, 1922, to the F. A. Buttery & Company department store in Havre, Montana, with the sequentially issued call letters of KFBB. It made its debut broadcast on the evening of August 22, 1922. The station originally broadcast on the standard "entertainment" wavelength of 360 meters (833 kHz).

In late 1928 KFBB was assigned to 1360 kHz, sharing time with KGIR (now KXTL) in Butte. In the fall of 1929, KFBB moved to Great Falls, making its debut broadcast there on September 30, 1929. The station moved to 1280 kHz in early 1930, and now no longer had to share time with any other stations. In March 1941, under the provisions of the North American Regional Broadcasting Agreement, stations on 1280 kHz were moved as a group to 1310 kHz, which has been the station's assignment up to the present.

In 1969 KFBB's call letters were changed to KKGF, and three years later they became KEIN.

Beginning in 2011 the station was off the air for an extended period of time. In January, property owner Creed Evans reported that someone had broken into the transmitter building and switched off the breakers, killing the signal. Munson Radio president Steve Dow held the license for KEIN, but was unable to make repairs because he was locked out of the transmitter building, as part of an October 2010 court order giving him 30 days to vacate the premises. This was the result of a court suit initiated by Evans against Dow, who was found to have failed to keep insurance and to maintain the facility.

In the intervening years a series of documents were filed with the FCC to someday resume on-air operations, including a filing granted April 24, 2014. FCC records showed the station back on the air as of that date. Effective May 18, 2018, the station was placed into receivership as part of a judgement obtained by Creed Evans against Munson Radio, Inc. The FCC assigned the station's license to Steve J. Fitzpatrick, Esq., Receiver effective November 15, 2018. The station was transferred out of receivership to Tiger Butte Broadcasting, Inc. effective September 24, 2019.

In January 2021, KEIN changed their format from oldies to comedy, branded as "13 KEIN", with the slogan "Montana's Comedy Network".

References

External links

FCC History Cards for KEIN (covering KFBB / KKGF / KEIN from 1927-1981)

EIN
Radio stations established in 1922
1922 establishments in Montana
Comedy radio stations in the United States


Toy () is a one-man project band of Korean pop singer-songwriter and pianist You Hee-yeol.

Career
Toy started as a duo of You Hee-yeol and Yoon Jeong-oh, and was named after their two initials 'Y', as in Two + Y = Toy.

However, after releasing Toy's debut album, Yoon Jeong-oh left the band to study overseas and You Hee-yeol joined the navy for his mandatory military service. You Hee-yeol has been the sole member of Toy since 1996.

After his discharge from military service, You released Toy's second studio album Yooheeyeol. The title song "Remember I Was Next to You" (), sung by Kim Yeon-woo, became a big hit and the album was a commercial success.

In 1997, Toy released the third studio album Present and also started a record label named Toy Music (currently Antenna). After a six-year hiatus from Fermata (2001), the band released their sixth studio album Thank You, with the title song "A Passionate Goodbye" () featuring vocals by E Z Hyoung.

Discography

Studio albums
 Da Capo (2014)
 Thank You (2007)
 Fermata (2001)
 A Night in Seoul (1999)
 Present (1997)
 Youheeyeol (1996)
 Inside My Heart (1994)

Live albums
 Toy Live (2001)

Compilation albums
 The History of Toy (2001)

Awards

Korean Music Awards

Mnet Asian Music Awards

References

External links
 Toy's official website

K-pop music groups
Electronica music groups
South Korean pop music groups
Korean Music Award winners
Melon Music Award winners


Semčice is a municipality and village in Mladá Boleslav District in the Central Bohemian Region of the Czech Republic. It has about 800 inhabitants.

References

External links

Official website

Villages in Mladá Boleslav District


Henrik Nicolai Clausen (22 April 1793 – 28 March 1877) was a Danish theologian and national liberal politician. He was a member of the National Constitutional Assembly from 1848 to 1849, of the Folketing from 1849 to 1853 and of the Landsting from 1853 to 1863.

Early life and education
Henrik Nicolai Clausen was born on the island of Lolland, the son of resident chaplin and later provost  H. G. Clausen (1759-1840) and Sophia M. Schiern (1769-1817). He was the elder brother of theologian Emil Theodor Clausen (1802-1851). The family moved to Copenhagen when he was four years old. He graduated from the Metropolitan School in 1809.

Clausen became a student in 1809 and a candidate in theology in 1813. He won the university's gold medal for Fremstilling og Bedømmelse af Apologeternes Beviser for Kristendommen imod hedenske og jødiske Modstandere in 1815. and became a doctor of philosophy in 1817.

Career
From 1820 he held a professorial chair in theology at the University of Copenhagen where his theological rationalism influenced Magnús Eiríksson and was one of the instructors of Søren Kierkegaard .

He wrote, besides other works, Romanism and Protestantism (1825); Popular Discourses on the Reformation (1836); a commentary on the synoptical Gospels, and Christian Dogmatics (1867).

In 1840 he was chosen a deputy to the States, and near the end of 1848 was appointed a member of the Moltke II Cabinet. He was a member of the National Constitutional Assembly from 1848 to 1849, of the Folketing from 1849 to 1853 and of the Landsting from 1853 to 1863.

Personal life
Clausen married on 8 December 1821 in the Church of Our Lady in Copenhagen Birgitte Francisca Swane (1797-1875), daughter of brewer and timber merchant Hans Swane (1753-1803) and Johanne Marie Gad (1767-1842). They were the parents of the theologian  Johannes Clausen (1830-1905).

He died on 27 March 1877 and is buried in Copenhagen's Assistens Cemetery.

Awards and commemoration

Clausen was created a Knight in the Order of the Dannebrog in 1836 and a Commander of the Order of the Dannebrog in 1850. He was awarded the Cross of Honour in 1869 and the Grand Cross in 1871.

A portrait painting of him by C. A. Jensen (1827) and another one by Wilhelm Marstrand are in the collection of the Museum of National History at Frederiksborg Castle in Hillerød. He is also depicted on Constantin Hansen's group portrait painting of The Danish Constituent Assembly (Christiansborg Palace). Herman Wilhelm Bissen (1858, Danish National Gallery) and Theobald Stein (1865) have both created portrait busts of him. An enlarged version of Bissen's portrait bust created by his son Vilhelm Bissen was installed in front of the University of Copenhagen on Frue Plads in 1878.

H. N. Clausens Gade in Aarhus is named after him.

References

External links
 Books on Archive.org Henrik Nicolai Clausen

1793 births
1877 deaths
Danish male writers
Danish Protestant theologians
19th-century Protestant theologians
Members of the Folketing
Members of the Landsting (Denmark)
University of Copenhagen alumni
Rectors of the University of Copenhagen
19th-century male writers
Members of the Rigsrådet (1855-1866)
Grand Crosses of the Order of the Dannebrog
Burials at Assistens Cemetery (Copenhagen)


The Archdiocese of Łódź () is a Latin Church archdiocese of the Catholic Church located in the city of Łódź in Poland. The archdiocese covers the central area of Łódź Voivodeship. As of 2016 weekly mass attendance was 23.4% of the archdiocese's Catholic population, making it the second least devout diocese in Poland after the Archdiocese of Szczecin-Kamień (22.7%).

History
 December 10, 1920: Established as Diocese of Łódź
 March 25, 1992: Promoted as Metropolitan Archdiocese of Łódź

Leadership

 Bishops
 Vincenzo Tymieniecki (1921.04.11 – 1934.08.10)
 Włodzimierz Bronisław Jasiński (1934.11.30 – 1946.12.12)
 Michał Klepacz (1946.12.20 – 1967.01.29)
 Józef Rozwadowski (1968.10.29 – 1986.01.24)
 Władysław Ziółek (1986.01.24 – 1992.03.25)
 Archbishops
 Władysław Ziółek (1992.03.25 – 2012.07.11)
 Marek Jędraszewski (2012.07.11 – 2017.01.27)
 Grzegorz Ryś (2017.09.14 – present)

Suffragan dioceses
 Łowicz

See also
Roman Catholicism in Poland

References

External links
 GCatholic.org
 Catholic Hierarchy
  Diocese website

Roman Catholic dioceses in Poland
Christian organizations established in 1920
Organisations based in Łódź
Roman Catholic dioceses and prelatures established in the 20th century


Elinor Klapp-Phipps Park is an open natural park located in northern Tallahassee, Florida, United States and operated by the City Of Tallahassee. The property is owned by Northwest Florida Water Management District.

History
The land was originally used as farm land by the Seminole Indians and later became the cotton plantations Mossview Plantation established by Amos Whitehead and Meridian Plantation, a quail hunting plantation established by Dwight F. Davis of Davis Cup fame. In 1945, the property was acquired by Griscom Bettle followed by John H. H. Phipps and in 1958 inherited by Colin Phipps. Colin Phipps purchased nearby additional property which is now included as part of the park.

Operation
The property is maintained and managed by the City of Tallahassee. Tallahassee is charged with preserving and protecting the property as a Lake Jackson watershed as well as providing the opportunity for diverse environmental education and recreation for all ages, consistent with maintaining the resource base.

The park has miles of trails for hiking, bicycling, walking, and horseback riding through old fields, open pine woods, and mixed pine-hardwood forest. This environment is home to a variety of flora and fauna.

The park is home to the annual Swamp Forest Trail Marathon, Half Marathon, and 6.5 Mile Run which takes place the first Saturday in January. This race course covers beautiful rolling terrain along both single-track and multi-use trails. Proceeds from the event benefit the Tallahassee Friends of Our Parks Foundation, Inc. and are designated for trail maintenance and improvements in the park. This event is limited to 150 runners. The park also host two events of the Gulf Winds Summer Trail Series each year.

The park is home to the Red Bug Trail Mountain Bike Trail: The Red Bug Mountain Bike Trail is one of the oldest in the city park system. The trail is a 4-mile trail that is the most tight and technical of all the city park trails and is considered to be an upper level intermediate trail.

References
Wetland Extension UFL
Red Hills Horse Trials/Elinor Klapp-Phipps Park
Elinor Klapp-Phipps Park

Parks in Tallahassee, Florida


Leoni Leo (subtitled The Life of an Armenian Adventurer) is a 1917 Hungarian adventure film directed by Alfréd Deésy. The Jozsef Pakots screenplay was adapted from the original novel by George Sand called Leone Leoni. The sets were designed by Sironthai Istvan.

Plot
Lugosi plays the noble bandit Baron Leone Leo, who leads a group of roguish gentlemen known as "the Ten". He tricks Juliette, whose father is the richest jeweler in Brussels, into thinking he is in love with her, but he is really just after her for her money.

Cast
 Norbert Dán
 Béla Lugosi as Leoni Leo (credited as Arisztid Olt)
 Annie Góth as Juliette
 Lilla Bársony as Princess Zagarolo
 Róbert Fiáth as Marquis Lorenzo
 Lajos Gellért as Róbert (credited as Viktor Kurd)
 Marel Rolla as Carmen
 Gusztáv Turán as Mario
 Klara Pet
 Loth Ila
 Richard Kornay

See also
 Béla Lugosi filmography

References

External links

1917 films
1917 adventure films
Hungarian black-and-white films
Hungarian silent films
Films directed by Alfréd Deésy
Austro-Hungarian films
Films based on French novels
Films based on works by George Sand


Augusta Huiell Seaman (April 3, 1879 – June 5, 1950) was an American author of children's literature.

Augusta Huiell Seaman was born Augusta Curtiss Huiell in New York City, on April 3, 1879, the daughter of the bookkeeper John Valentine Huiell and his third wife, Anna Curtiss.

She graduated from Normal College (later renamed Hunter College) in New York City in 1900 and went on to teach elementary school. She married Robert Seaman in 1906. Following her marriage, she devoted her time to writing. Her career writing mysteries for children began with the publication of The Boarded up House which ran serially in St. Nicholas Magazine in 1914.

Her only child, Helen Roberta (Bobbie) was born in 1915. Her husband Robert died in 1927. In 1928 she married her second husband, Francis Parkman Freeman, foreman of the Phipps estate in Island Beach, New Jersey (now part of Berkeley Township, the setting for several of her later books).  While living in Island Beach, Augusta held various offices in the local government, including Borough clerk, Tax Collector, and Borough Registrar.

Over her career Seaman wrote and published over forty books for young people. She died at age seventy-one and is interred at Rosedale Cemetery in Orange, New Jersey.

Books
A few of Seaman's books have been reprinted, but many remain out of print. The rarest of her books are much sought after by collectors. Several of her novels were translated into Norwegian, Danish, and French.

 Jacqueline of the Carrier Pigeons (1910)
 When a Cobbler Ruled a King (1911) [copyright expired]
 Little Mamselle of the Wilderness (1913) [copyright expired]
 The Boarded-Up House (1915)  [copyright expired]
 The Sapphire Signet (1916) [copyright expired]
 The Girl Next Door (1917) [copyright expired]
 Three Sides of Paradise Green (1918) [copyright expired]
 Melissa-Across-the-Fence (1918) [copyright expired]
 The Slipper Point Mystery (1919) [copyright expired]
 Americans All; Stories to Tell Boys and Girls of Ten to Twelve (1919) [copyright expired]
 The Crimson Patch (1920) [copyright expired]
 The Dragon's Secret (1921) [copyright expired]
 The Mystery at Number Six (1922) [copyright expired]
 Tranquility House (1923)
 Sally Simms Adventures It (1924)
 The Edge of Raven Pool (1924)
 Bluebonnet Bend (1924)
 The Secret of Tate's Beach (1926)
 The Adventure of the Seven Keyholes (1926)
 The Shadow on the Dial (1927)
 The Disappearance of Anne Shaw (1928)
 A Book of Mysteries: Three Baffling Tales (1929)

 The Charlemonte Crest: A Mystery of Modern Haiti (1930)
 The Brass Keys of Kenwick (1931)
 The House in Hidden Lane: Two Mysteries for Younger Girls (1931)
 The Stars of Sabra (1932)
 The Inn Of The Twin Anchors (1932) -reprinted as The Mystery of the Old Violin
 The Mystery of the Empty Room (1933)
 Bitsy Finds the Clue: A Mystery of Williamsburg, Old and New"' (1934)
 The Riddle at Live Oaks (1934)
 The Figurehead of the 'Folly' (1935)
 The Strange Pettingill Puzzle: Two Mysteries for Boys and Girls (1936)
 Voice in the Dark (1937) [copyright was not renewed]
 The Pine Barrens Mystery (1937)
 The Vanderlyn Silhouette (1938)  [copyright was not renewed]
 The Mystery at Linden Hall (1939)  [copyright was not renewed]
 The Curious Affair at Heron Shoals (1940)  [copyright was not renewed]
 The Missing Half (1941)  [copyright was not renewed]
 The Case of the Calico Crab (1942)
 The Mystery of the Folding Key (1943)  [copyright was not renewed]
 The Half-Penny Adventure (1945)
 The Mystery of the Other House (1947)
 The Vanishing Octant Mystery (1949)

References

External links

 Augusta Huiell Seaman at Bookfever.com

1879 births
1950 deaths
American children's writers
Burials at Rosedale Cemetery (Orange, New Jersey)
Hunter College alumni
People from Berkeley Township, New Jersey
American women children's writers
20th-century American novelists
American women novelists
20th-century American women writers
Novelists from New York City
Novelists from New Jersey


The A4216 is a main road in Swansea, Wales.

Route
The road links Sketty with Gendros.  It begins at the junction at the bottom of Sketty Lane with Mumbles Road.  It continues up Sketty Lane, onto Sketty Park Road then bears right onto Dillwyn Road to the junction with the A4118 (Gower Road) at Sketty Cross.  It continues through this road then up Vivian Road past Tycoch.  The A4216 then continues along Cockett Road past Cwm Gwyn and through Cockett.  The final stretch of the A4216 is Station Road where the A4216 forms a cross roads with the A483 (Carmarthen Road).

Dual carriageway
The only dual carriageway section is along Sketty Lane.

References

Transport in Swansea
Roads in Wales


KIKF (104.9 FM) is a radio station broadcasting a country music format. Licensed to Cascade, Montana, United States, the station serves the Great Falls area. The station is currently owned by STARadio Corporation.

References

External links

IKF
Country radio stations in the United States


KAAK (98.9 FM) is a radio station broadcasting a Top 40 (CHR) format. Licensed to Great Falls, Montana, United States, the station serves the Great Falls area. The station is currently owned by Townsquare Media and licensed to Townsquare License, LLC.

Ownership
In June 2006, a deal was reached for KAAK to be acquired by Cherry Creek Radio from Fisher Radio Regional Group as part of a 24 station deal with a total reported sale price of $33.3 million.

Effective June 17, 2022, KAAK was acquired by Townsquare Media from Cherry Creek Radio as part of a 42 station/21 translator deal with a sale price of $18.75 million.

References

External links

AAK
Contemporary hit radio stations in the United States
Townsquare Media radio stations


A. Schulman was an American supplier of plastic compounding products, color concentrates, and additives before its acquisition by LyondellBasell in 2018.

Products
The company's products include:
 Low (LDPE) and high (HDPE) density polyethylenes under the Polyflam brand
 Polystyrene (PS), polypropylene (PP) and polyphenylenesulphide (PPS) also under the Polyflam brand
 Several derivaterized styrene polymers (ABS, Methyl Methacrylate Acrylonitrile Butadiene Styrene (MABS) and blends (ABS/PA, PC/ABS), polymethylmethacrylate (PMMA), and polycarbonate (PC) and blends (PC/PBT), under the Polyman brand
 Polyacetyls (POM) under the Schulaform brand
 Polyamides PA6 and PA66 under the Schulamid brand
 Polybutylene terephthalate (PBT) under the Schuladur A brand
 Polyurethane (PUR) under the Polypur brand
 Polyvinyl chloride (PVC) under the Polyvin brand
 Styrene acrylonitrile copolymer (SAN) under the Polyfort brand

History
The company was founded in 1928 by Alex Schulman by selling rubber products from a plant in Akron, Ohio.

In 1972, the company became a public company via an initial public offering.

In 1994, the company acquired Comalloy International, a subsidiary of Exxon based in Nashville, Tennessee.

In February 1995, the company acquired Texas Polymer Services.

In 1996, the company acquired the Specialty Compounding Division of Laurel Industries Inc., from Occidental Petroleum.

In 2007, the company acquired Delta Plast Group, based in Sweden.

In February 2008, the Company closed its facility in St. Thomas, Ontario.

In 2009, the company opened a Polybatch plant in Akron, Ohio.

In 2010, the company acquired McCann Color and closed its facility in Sharon Center, Ohio.

In April 2010, the company acquired ICO for $191 million.

Also in 2010, the company acquired Mash Compostos Plasticos of Brazil.

In 2016, the company sued the former owners of Citadel Plastics, a company it had previously acquired, for $272 million, claiming that they falsified information about the recycled content and other attributes of its products and that A. Schulman later had to stop selling these products.

References

External links
 A. Schulman website

1928 establishments in Ohio
2018 disestablishments in Ohio
2018 mergers and acquisitions
American companies established in 1928
American companies disestablished in 2018
Chemical companies established in 1928
Chemical companies disestablished in 2018
Chemical companies of the United States
Manufacturing companies based in Ohio


Maang Bharo Sajana () is a 1980 Indian Hindi-language drama film, produced by A. Purnachandra Rao under the Lakshmi Productions banner, and directed by T. Rama Rao. The film stars Jeetendra, Rekha, Moushumi Chatterjee, Kajal Kiran and music composed by Laxmikant–Pyarelal. The film is a remake of the Telugu film Karthika Deepam (1979). This was one of the four films T. Rama Rao directed with Jeetendra and Rekha that explored married relationships. The film did well commercially. Rekha was applauded for her performance as the other woman.

Plot
Chandru, a college student, is the son of Ram and Sita. Chandru is in a relationship with Geeta Sinha, the daughter of Doctor Sinha and they want to marry. One day, Dr. Sinha finds Geeta and Chandru on the road while Chandru's car has a puncture and they are asking for a lift. On recognizing Chandru he forbids Geeta from seeing him any further and after bringing Geeta home forbids her to leave home. Then he calls Ram (who is known to him) and tells him of the developments. He warns Ram to also forbid Chandru from seeing Geeta and not plan to marry her or he will suffer consequences. Ram feels insulted and when Chandru returns home, tells him that although Dr. Sinha has rejected his marriage proposal, Ram is with him and if Chandru manages to get Geeta of her free will into his home, he will arrange their marriage. Chandru manages to reach Geeta's bedroom and they elope to Chandru's home. When Doctor Sinha learns that Geeta has eloped, he goes to Ram's house, where the wedding is taking place, and insults Chandru, calling him a “bastard” and the like. Following this, Ram confesses to an event long ago, when he went to a construction site in UP near Benaras. He decided to visit a friend in Benaras who took him to a kotha where he had met Radha, a prostitute whom he rescued from her first client. Ram brought Radha to his construction site and they became close following the incident. After they fell in love, the river Ganges flooded and separated them. Ram thought Radha died and when he came home, his father had had a heart attack. Since his father was dying, his father asked him to marry Sita. Ram Kumar married Sita and was happy for 4–5 years and they had a son, Shaam. One day when he went to the railway station to pick up his mother-in-law, he saw Radha on the platform. He was happy that Radha was alive and took her to his guest house, telling her that for them to get married, he needs some time to talk to his family. Ram lacked the courage to tell Sita about Radha, so he hid the relationship from her, and continued the affair.

One day on a picnic with many children and their mothers, Sita met Radha, who saved baby Shaam from drowning in the swimming pool. They became friends. One day, Ram learned that Radha became pregnant, leaving Ram in a predicament. He tries to talk to Sita but fails. Meanwhile, Sita meets Radha in a sari store and Radha invites her to her home. Sita and Radha exchange notes about their husbands. After Radha's baby boy is born, Sita comes to Radha's home to take her for the Karva Chauth puja. Then Sita names the baby boy Chander Kumar (Chandru). After the puja, Sita takes Radha to her home to meet her husband and learns that Radha and her husband are not married due to the husband's problems. Them Ram enters and on seeing Ram, Radha leaves the scene silently. Sita takes up Radha's case and has Ram promise to get Radha justice from her husband. Ram goes to Radha's home and finds her packing up to leave after being betrayed by Ram. He then explains the whole story to her and promises to find a solution. The baby Chandru has a fever, so Ram and Radha take him to the hospital. Sita's mother sees the two of them leaving the hospital with the baby and tells Sita that Ram is the father of Radha's baby. Sita believes her and goes to Radha's home to offer her money to get out of Ram's life, calling her a "whore". Sita also tells her that one of them must die, so if Radha is not gone by the morning, Sita will kill herself. Ram comes to Radha's home and she tells him to go to Sita and pacify her, telling Sita that Radha is not a whore. Ram goes to Sita and tells her the whole story, clarifying that he was in love with Radha before he married Sita and he can't leave either of them, since they are both his loves. He tells Sita to take a call on the situation. Sita decides to accept Radha. On reaching Radha's home, Ram and Sita find that Radha has taken poison and Sita makes Ram fill Radha's Maang with red Sindoor from Sita's box. Radha receives a promise from Sita to bring up baby Chandru as her son. After Ram has finished telling his story, Dr. Sinha and his wife apologize to Ram and Sita, for the accusations, and Chandru and Geeta get married with everyone's blessings.

Cast

Jeetendra as Ram Kumar / Chandru (Double Role)
Rekha as Radha
Moushumi Chatterjee as Sita
Kajal Kiran as Geeta Sinha
Om Shivpuri as Dr. Sinha
Asrani as Jumerati
Chandana Choudhry as Sabeeha Khan
Yunus Parvez as Khan Sahib
Mohan Choti as Priest
Dheeraj Kumar as Shyam Kumar
Parveen Paul as Sita's Mother

Soundtrack
This was one of the first films for which Kavita Krishnamurthy sang. Anand Bakshi wrote all the lyrics.

Reception
The film did well at the box office. Dilip Thakur of The Times of India wrote of the film's storyline being "where a hero pleases an ordinary-looking girl but leaves her for an attractive woman". The film was described as one of the successful melodramas of T. Rama Rao. According to The Indian Journal of Social Work, Maang Bharo Sajana is one of the films which "reinstate the image of a feet-worshipping, passive wife".

References

External links

1980 films
1980s Hindi-language films
Hindi remakes of Telugu films
Films directed by T. Rama Rao
Films scored by Laxmikant–Pyarelal


Moroccan Spirit is a down tempo new age/ethnic fusion musical project/album by German musicians Ralf Hamm, Markus Staab and Claus "The Brave" Zundel, Ibiza-based producers of Sacred Spirit, B-Tribe and other projects. Their music is often characterized as different from other projects by The Brave. They combine traditional Moroccan music with moderate club beats and synthesizer enhancement. Only one album was released under the project name in 2002. The album is sometimes counted as one of Sacred Spirit's (including some official sources). The Brave recorded authentic Moroccan singers and instruments for this album to which they then added their trademark ambiance and mood. The vocals are generally solo-voice, some male and some female. The track "Midunya" is a reworking of Medunya from the One Little Creature album, now with a more Arabic feel.

Track listing

 Music For 1001 Nights (Intro)  2:31
 Jilala I: Nocturnal Ritual  6:06
 Jim I Nim  3:45
 Moroccan Soul  6:03
 Moussem Of Regragas  4:52
 Midunya  5:07
 Narcisse Noir  3:38
 Derviche  5:11
 Jilala II: Nocturnal Ritual  3:29
 La Mamounia  7:43
 Moussem Mediouna 4:12
 Music For 1001 Nights (Outro) 4:52

Some of tracks used fragments of Persian traditional music as accompaniment, such as a fragment of vocal by Master Mohammad Reza Shajarian in #3; a fragment of playing of Persian santour by Master Faramarz Payvar in #5; a fragment of "Night, Silence, desert" album by Master Keyhan Kalhor in #8; and a fragment of "Dastan" Album in "Chahargah mode" by Master Parviz Meshkatian in #10.

New-age music groups
Ambient music groups
German techno music groups
German world music groups
German electronic music groups